EVG620 Top Side Mask Aligner
The EVG 620 provides high precision manual alignment on wafers. This is the main maks aligner of the cleanroom and can handle wafer sizes up to 150mm. Exposure can be performed in hard, soft and proximity modes.
| Facility: | Clean Rooms - Nanofabrication |
| Part of: | School of Electronics & Computer Science Physical Sciences and Engineering |
| Location: | New Mountbatten |
Contact
LESSEY, MARK
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